Question
What is a characteristic of DIP packaging used for integrated circuits?
Answer Options
- A) Extremely low stray capacitance (dielectrically isolated package)
- B) Extremely high resistance between pins (doubly insulated package)
- C) Two chips in each package (dual in package)
- D) Two rows of connecting pins on opposite sides of package (dual in-line package)
Correct Answer: D
Explanation
DIP stands for Dual In-line Package. It is a long-standing, through-hole component package design widely used for integrated circuits (ICs) before the prevalence of surface-mount technology. Its name describes its characteristic physical structure.
The characteristic of DIP packaging is that it has two rows of connecting pins on opposite sides of the package. These pins are designed to be inserted into holes on a circuit board or a socket. While still used for some slower-speed applications, its long pins make it unsuitable for high-frequency (VHF and above) applications due to excessive parasitic inductance.
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