Question
Which of the following device packages is a through-hole type?
Answer Options
- A) DIP
- B) PLCC
- C) BGA
- D) SOT
Correct Answer: A
Explanation
Electronic components are broadly divided into two mounting categories: through-hole and surface mount. Through-hole components have leads that are inserted through holes in the circuit board and soldered on the opposite side, while surface-mount components are soldered directly onto pads on the board’s surface.
DIP (Dual In-line Package) is a classic through-hole integrated circuit package. It is characterized by two parallel rows of connecting pins designed to be inserted into a breadboard or through a PCB. PLCC, BGA, and SOT are all common surface-mount technology (SMT) packages used for modern components.
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